Abstract: This talk offers an introductory overview of the performance analysis of chip-to-chip interconnects, with a focus on those implemented on printed circuit boards (PCBs). It will present the general context in which these interconnects operate, including the typical structure of a communication channel and the main challenges of high-speed design. The presentation will include a brief look at the electromagnetic simulation process—from the representation of the physical model to the visualization of some basic results. The goal is to provide an accessible general perspective for students and engineers interested in signal integrity topics.
Prof. Reydezel Torres Torres received his degree in Electronic Engineering from the Instituto Tecnológico de Querétaro in 1997, and his M.Sc. and Ph.D. degrees in Science from the National Institute of Astrophysics, Optics and Electronics (INAOE) in 2000 and 2003, respectively.
From 2001 to 2002, he was a visiting scholar at the Interuniversity Microelectronics Centre (IMEC) in Belgium, where he was responsible for a research project on RF device modeling for Alcatel Microelectronics. He later became a founding member of Intel’s Systems Research Center in Guadalajara, where he contributed to the establishment of the signal integrity laboratory. Since 2007, he has been a professor and researcher at INAOE, where he has supervised dozens of master’s and doctoral theses as part of academia-industry collaborations with companies such as Intel, Qualcomm, GlobalFoundries, Isola, and AMD.
He has authored numerous articles published in peer-reviewed journals and presented at specialized conferences. Within the IEEE Electron Devices Society, work conducted in collaboration with his students received the biennial Best Student Paper Award in 2015, 2017, and 2024. Additionally, in 2012, 2016, and 2019, his research was nominated for the Best Contribution Award at the Silicon Valley Electronic Design Conference (DesignCon).